Application

14850070 · Matrix Lid Heatspreader for Flip Chip Package

Filed 2015-09-10 · Granted · Patent 9640469 (2017-05-02) The official file ↗The patent and its PDF ↗ · Art unit 2812 · Examiner Reema Patel Typical · CPC H10W 74/014 · CHIP PACKAGING TECHNOLOGIES, LLC · C. Tumey Law Group PLLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

10.5 mo

to disposition 19.7 mo

Statutes raised

102 103

1 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.