Application

14879622 · Semiconductor Package Having Etched Foil Capacitor Integrated Into Leadframe

Filed 2015-10-09 · Granted · Patent 9373572 (2016-06-21) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner Jami Valentine Miller Easy · CPC H10W 70/475 · Texas Instruments Incorporated · TEXAS INSTRUMENTS INCORPORATED

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

5.9 mo

to disposition 8.4 mo

Statutes raised

0 actions read

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