Application

14933302 · METHOD AND STRUCTURE FOR WAFER LEVEL PACKAGING WITH LARGE CONTACT AREA

Filed 2015-11-05 · Granted · Patent 9502268 (2016-11-22) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Junaiden Mirsalahuddin Hard · CPC H10W 20/20 · Alpha and Omega Semiconductor Incorporated · Chen-Chi Lin

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

5.7 mo

to disposition 12.6 mo

Statutes raised

0 actions read

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