Application

14952294 · WAFER-LEVEL FLIP CHIP DEVICE PACKAGES AND RELATED METHODS

Filed 2015-11-25 · Granted · Patent 9647188 (2017-05-09) The official file ↗The patent and its PDF ↗ · Art unit 2814 · Examiner Tifney L Skyles Hard · CPC H10H 20/857 · COMERICA BANK · Morgan, Lewis & Bockius LLP (BO)

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

13.6 mo

to disposition 17.4 mo

Statutes raised

0 actions read

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