Application

14957865 · WAFER LEVEL CHIP SCALE PACKAGE (WLCSP) HAVING EDGE PROTECTION

Filed 2015-12-03 · Granted · Patent 9576912 (2017-02-21) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10W 20/40 · STMICROELECTRONICS PTE LTD · STMICROELECTRONICS, INC. (ADDMG)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

9.5 mo

to disposition 14.7 mo

Statutes raised

102

1 actions read

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