PATLY.AIApplication
14986727 · MULTI-LEVEL CHIP INTERCONNECT
Filed 2016-01-04 · Granted · Patent 9871017 (2018-01-16) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner Jose R Diaz Easy · CPC H10W 90/00 · Infineon Technologies AG · SLATER MATSIL, LLP/INFINEON
Office actions
1
first was Restriction requirement
RCEs
0
no appeal
To first action
11.6 mo
to disposition 24.4 mo
Statutes raised
102
1 actions read