Application

14994289 · THREE-DIMENSIONAL HYBRID PACKAGING WITH THROUGH-SILICON-VIAS AND TAPE-AUTOMATED-BONDING

Filed 2016-01-13 · Granted · Patent 9741695 (2017-08-22) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Dao H Nguyen Easy · CPC H10W 90/00 · Global Foundries Inc. · GIBB INTELLECTUAL PROPERTY LAW FIRM LLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

8.1 mo

to disposition 19.3 mo

Statutes raised

102 103

2 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.