Application

14994598 · IMPLANT AFTER THROUGH-SILICON VIA (TSV) ETCH TO GETTER MOBILE IONS

Filed 2016-01-13 · Granted · Patent 10170337 (2019-01-01) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Khatib A Rahman Typical · CPC H10P 36/07 · International Business Machines Corporation · INACTIVE INTERNATIONAL BUSINESS MACHINES CORP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

11.9 mo

to disposition 35.6 mo

Statutes raised

103

3 actions read

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