Application

15012086 · Semiconductor Device Having a Chip Under Package

Filed 2016-02-01 · Granted · Patent 9859251 (2018-01-02) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Niki Hoang Nguyen Easy · CPC H10W 90/00 · Infineon Technologies AG · MURPHY, BILAK & HOMILLER/INFINEON TECHNOLOGIES

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

8.0 mo

to disposition 23.0 mo

Statutes raised

102 103

2 actions read

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