Application

15087640 · MICROELECTRONIC PACKAGES HAVING MOLD-EMBEDDED TRACES AND METHODS FOR THE PRODUCTION THEREOF

Filed 2016-03-31 · Granted · Patent 9899298 (2018-02-20) The official file ↗The patent and its PDF ↗ · Art unit 1721 · Examiner Olatunji A Godo Easy · CPC H01M 50/44 · FREESCALE SEMICONDUCTOR INC. · NXP (FS) - LKGlobal

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

20.4 mo

to disposition 22.7 mo

Statutes raised

0 actions read

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