Application

15117935 · COPPER-CERAMIC BONDED BODY AND POWER MODULE SUBSTRATE

Filed 2016-08-10 · Granted · Patent 10103035 (2018-10-16) The official file ↗The patent and its PDF ↗ · Art unit 1784 · Examiner Vera Katz Hard · CPC H10W 99/00 · MITSUBISHI MATERIALS CORPORATION · Troutman Pepper Locke LLP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

5.0 mo

to disposition 26.2 mo

Statutes raised

102 103

2 actions read

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