Application
15137740 · WAFER WITH IMPROVED PLATING CURRENT DISTRIBUTION
Filed 2016-04-25 · Granted · Patent 9627317 (2017-04-18) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Tucker J Wright Typical · CPC H10W 20/43 · GLOBALFOUNDRIES Inc. · GLOBALFOUNDRIES INC.
Office actions
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first was Notice of allowance
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To first action
8.2 mo
to disposition 11.8 mo
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