Application

15145369 · INTERCONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF

Filed 2016-05-03 · Granted · Patent 9837306 (2017-12-05) The official file ↗The patent and its PDF ↗ · Art unit 2823 · Examiner George R Fourson III Easy · CPC H10W 20/40 · TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. · Cooper Legal Group LLC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

6.0 mo

to disposition 19.1 mo

Statutes raised

103

2 actions read

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