PATLY.AIApplication
15162944 · STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUGH WAFER VIA WITHIN CMOS CIRCUITRY
Filed 2016-05-24 · Granted · Patent 9842838 (2017-12-12) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Bryan R. Junge Hard · CPC H10D 84/854 · INTERNATIONAL BUSINESS MACHINES CORPORATION · INACTIVE - POU IPLAW
Office actions
2
first was Non-final rejection
RCEs
0
no appeal
To first action
4.6 mo
to disposition 18.6 mo
Statutes raised
103 112 DP
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