Application

15173037 · ENCAPSULATED DIES WITH ENHANCED THERMAL PERFORMANCE

Filed 2016-06-03 · Granted · Patent 10020206 (2018-07-10) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10W 74/121 · RF Micro Devices, Inc. · WITHROW & TERRANOVA, P.L.L.C.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.1 mo

to disposition 25.2 mo

Statutes raised

103 112

2 actions read

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