Application

15225284 · WAFER LEVEL PACKAGE AND FABRICATION METHOD

Filed 2016-08-01 · Granted · Patent 9871015 (2018-01-16) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Lalrinfamkim Hmar Malsawma Easy · CPC H10W 72/0198 · Amkor Technology, Inc. · Amkor Technology Singapore Holding Pte. Ltd.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

3.4 mo

to disposition 17.5 mo

Statutes raised

103 112

2 actions read

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