Application

15250701 · Wire Bond Through-Via Structure and Method

Filed 2016-08-29 · Granted · Patent 9741680 (2017-08-22) The official file ↗The patent and its PDF ↗ · Art unit 2823 · Examiner Walter H Swanson Typical · CPC H10W 74/019 · PFG IP LLC · THOMAS M. FREIBURGER

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

0.6 mo

to disposition 11.8 mo

Statutes raised

102

1 actions read

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