PATLY.AIApplication
15272758 · WAFER LEVEL INTEGRATION INCLUDING DESIGN/CO-DESIGN, STRUCTURE PROCESS, EQUIPMENT STRESS MANAGEMENT, AND THERMAL MANAGEMENT
Filed 2016-09-22 · Granted · Patent 10811305 (2020-10-20) The official file ↗The patent and its PDF ↗ · Art unit 2813 · Examiner Vicki B Booker Typical · CPC H10D 86/01 · International Business Machines Corporation · INTERNATIONAL BUSINESS MACHINES CORPORATION
Office actions
5
first was Restriction requirement
RCEs
2
no appeal
To first action
11.2 mo
to disposition 48.9 mo
Statutes raised
103 112
4 actions read