Application

15287093 · PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

Filed 2016-10-06 · Granted · Patent 10622235 (2020-04-14) The official file ↗The patent and its PDF ↗ · Art unit 3731 · Examiner Chelsea E. Stinson Typical · CPC H10P 72/1912 · INTERNATIONAL BUSINESS MACHINES CORPORATION · INACTIVE INTERNATIONAL BUSINESS MACHINES CORP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

30.1 mo

to disposition 42.3 mo

Statutes raised

103

1 actions read

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