Application

15292613 · PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

Filed 2016-10-13 · Granted · Patent 10090180 (2018-10-02) The official file ↗The patent and its PDF ↗ · Art unit 3788 · Examiner Steven Alan Reynolds Typical · CPC H10P 72/1912 · INTERNATIONAL BUSINESS MACHINES CORPORATION · INACTIVE - POU IPLAW

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

11.1 mo

to disposition 23.6 mo

Statutes raised

102 103 DP

2 actions read

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