PATLY.AIApplication
15370307 · HEAT SINK FOR A SEMICONDUCTOR CHIP DEVICE
Filed 2016-12-06 · Granted · Patent 9859186 (2018-01-02) The official file ↗The patent and its PDF ↗ · Art unit 2816 · Examiner Jasmine Jhihan B Clark Easy · CPC H10W 70/68 · Coriant Advanced Technology, LLC · Stratford Group Ltd./Nokia US
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first was Ex parte Quayle
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