Application

15478508 · FABRICATION METHOD OF SEMICONDUCTOR PACKAGE

Filed 2017-04-04 · Granted · Patent 10163662 (2018-12-25) The official file ↗The patent and its PDF ↗ · Art unit 2894 · Examiner Tony Tran Hard · CPC H10W 74/012 · Siliconware Precision Industries Co., Ltd. · Mintz Levin/Special Group

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

0.7 mo

to disposition 20.7 mo

Statutes raised

102 103

3 actions read

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