Application

15484056 · MANUFACTURING PROCESS OF WAFER LEVEL CHIP PACKAGE STRUCTURE HAVING BLOCK STRUCTURE

Filed 2017-04-10 · Granted · Patent 9953960 (2018-04-24) The official file ↗The patent and its PDF ↗ · Art unit 2826 · Examiner Alexander O Williams Typical · CPC H10W 90/00 · ChipMOS Technologies Inc. · JCIPRNET

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

5.6 mo

to disposition 12.5 mo

Statutes raised

103

1 actions read

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