PATLY.AIApplication
15628651 · MULTI-CHIP PACKAGE STRUCTURE MANUFACTURING PROCESS AND WAFER LEVEL CHIP PACKAGE STRUCTURE MANUFACTURING PROCESS
Filed 2017-06-21 · Granted · Patent 10002815 (2018-06-19) The official file ↗The patent and its PDF ↗ · Art unit 2899 · Examiner Peniel M Gumedzoe Typical · CPC H10W 90/00 · ChipMOS Technologies Inc. · JCIPRNET
Office actions
2
first was Non-final rejection
RCEs
0
no appeal
To first action
3.1 mo
to disposition 11.9 mo
Statutes raised
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2 actions read