Application

15651894 · STRUCTURE AND METHOD OF BONDING CHIP WITH ELECTRONIC CIRCUIT

Filed 2017-07-17 · Granted · Patent 9978714 (2018-05-22) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Niki Hoang Nguyen Easy · CPC H10W 72/075 · GRAPHENE SECURITY LIMITED · TW Patent Office

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

7.4 mo

to disposition 10.2 mo

Statutes raised

0 actions read

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