Application

15685564 · METHODS AND STRUCTURES FOR MITIGATING ESD DURING WAFER BONDING

Filed 2017-08-24 · Granted · Patent 10236263 (2019-03-19) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Jami Valentine Miller Easy · CPC H10W 42/60 · GLOBALFOUNDRIES Inc. · GLOBALFOUNDRIES INC.

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

10.9 mo

to disposition 18.8 mo

Statutes raised

112

1 actions read

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