PATLY.AIApplication
15720374 · POLYMER LID WAFER-LEVEL PACKAGE WITH AN ELECTRICALLY AND THERMALLY CONDUCTIVE PILLAR
Filed 2017-09-29 · Granted · Patent 10804875 (2020-10-13) The official file ↗The patent and its PDF ↗ · Art unit 2837 · Examiner Jaydi A San Martin Typical · CPC H03H 9/02897 · Avago Technologies International Sales Pte. Limited · Foley & Lardner LLP/ Broadcom Corporation
Office actions
1
first was Non-final rejection
RCEs
0
no appeal
To first action
29.1 mo
to disposition 36.5 mo
Statutes raised
103
1 actions read