Application

15729002 · STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUGH WAFER VIA WITHIN CMOS CIRCUITRY

Filed 2017-10-10 · Granted · Patent 10170476 (2019-01-01) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Bryan R. Junge Hard · CPC H10D 84/854 · INTERNATIONAL BUSINESS MACHINES CORPORATION · INACTIVE INTERNATIONAL BUSINESS MACHINES CORP

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

4.7 mo

to disposition 14.7 mo

Statutes raised

1 actions read

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