PATLY.AIApplication
15769705 · STACKED DIE PACKAGE WITH THROUGH-MOLD THERMALLY CONDUCTIVE STRUCTURES BETWEEN A BOTTOM DIE AND A THERMALLY CONDUCTIVE MATERIAL
Filed 2018-04-19 · Granted · Patent 10541190 (2020-01-21) The official file ↗The patent and its PDF ↗ · Art unit 2812 · Examiner Scott B Geyer Easy · CPC H10W 40/77 · Intel Corporation · SCHWABE, WILLIAMSON & WYATT, P.C.
Office actions
2
first was Restriction requirement
RCEs
0
no appeal
To first action
6.9 mo
to disposition 21.1 mo
Statutes raised
102 103 112
2 actions read