Application

15804847 · MAKING ELECTRICAL COMPONENTS IN HANDLE WAFERS OF INTEGRATED CIRCUIT PACKAGES

Filed 2017-11-06 · Granted · Patent 10204977 (2019-02-12) The official file ↗The patent and its PDF ↗ · Art unit 2817 · Examiner Bradley Smith Typical · CPC H10D 1/692 · INVENSAS CORPORATION · Invensas Corporation

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

4.2 mo

to disposition 15.2 mo

Statutes raised

103 112

1 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.