Application

15865328 · Repackaged Reconditioned Die Method and Assembly

Filed 2018-01-09 · Granted · Patent 10115645 (2018-10-30) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner David A Zarneke Typical · CPC H10W 76/12 · GLOBAL CIRCUIT INNOVATIONS, INC. · Global Circuit Innovations Incorporated

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

5.3 mo

to disposition 9.7 mo

Statutes raised

1 actions read

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