Application

15867563 · STRUCTURES FOR PACKAGING STRESS-SENSITIVE MICRO-ELECTRO-MECHANICAL SYSTEM STACKED ONTO ELECTRONIC CIRCUIT CHIP

Filed 2018-01-10 · Granted · Patent 10233074 (2019-03-19) The official file ↗The patent and its PDF ↗ · Art unit 2829 · Examiner Daniel B Whalen Typical · CPC B81B 7/0045 · Texas Instruments Incorporated · TEXAS INSTRUMENTS INCORPORATED

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

5.4 mo

to disposition 14.2 mo

Statutes raised

112 DP

1 actions read

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