Application

15872397 · WAFER LEVEL PACKAGE AND FABRICATION METHOD

Filed 2018-01-16 · Granted · Patent 10665567 (2020-05-26) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Lalrinfamkim Hmar Malsawma Easy · CPC H10W 72/0198 · Amkor Technology, Inc. · Amkor Technology Singapore Holding Pte. Ltd.

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

5.2 mo

to disposition 28.3 mo

Statutes raised

102 112 DP

3 actions read

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