Application

15898694 · ELECTRONIC DEVICES WITH BOND PADS FORMED ON A MOLYBDENUM LAYER

Filed 2018-02-19 · Granted · Patent 10840179 (2020-11-17) The official file ↗The patent and its PDF ↗ · Art unit 2813 · Examiner Hoa B Trinh Typical · CPC H10W 72/90 · TEXAS INSTRUMENTS INCORPORATED · TEXAS INSTRUMENTS INCORPORATED

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

7.3 mo

to disposition 32.9 mo

Statutes raised

103 112

4 actions read

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