Application

15921852 · INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING AND METHOD OF FORMING SAME

Filed 2018-03-15 · Granted · Patent 10714411 (2020-07-14) The official file ↗The patent and its PDF ↗ · Art unit 2813 · Examiner Hoa B Trinh Typical · CPC H10W 42/00 · GLOBALFOUNDRIES INC. · HOFFMAN WARNICK LLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

12.9 mo

to disposition 28.0 mo

Statutes raised

102 103

1 actions read

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