Application

15929296 · SEMICONDUCTOR CHIP PACKAGE COMPRISING A LEADFRAME CONNECTED TO A SUBSTRATE AND A SEMICONDUCTOR CHIP, AND A METHOD FOR FABRICATING THE SAME

Filed 2020-04-23 · Granted · Patent 11037856 (2021-06-15) The official file ↗The patent and its PDF ↗ · Art unit 2892 · Examiner Robert Thomas Huber Hard · CPC H10W 90/811 · Infineon Technologies AG · Harrity & Harrity, LLP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

1.2 mo

to disposition 13.7 mo

Statutes raised

102 103

2 actions read

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