Application

15952935 · MICROELECTRONIC COMPONENTS WITH FEATURES WRAPPING AROUND PROTRUSIONS OF CONDUCTIVE VIAS PROTRUDING FROM THROUGH-HOLES PASSING THROUGH SUBSTRATES

Filed 2018-04-13 · Granted · Patent 10177086 (2019-01-08) The official file ↗The patent and its PDF ↗ · Art unit 2823 · Examiner Hsien Ming Lee Easy · CPC H10D 84/0158 · Invensas Corporation · Invensas Corporation

Office actions

first was Ex parte Quayle

RCEs

no appeal

To first action

2.1 mo

to disposition 8.9 mo

Statutes raised

0 actions read

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