PATLY.AIApplication
15992613 · WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
Filed 2018-05-30 · Granted · Patent 10755992 (2020-08-25) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10W 74/121 · Qorvo US, Inc. · Qorvo and Withrow + Terranova
Office actions
2
first was Non-final rejection
RCEs
1
no appeal
To first action
8.8 mo
to disposition 26.9 mo
Statutes raised
103
2 actions read