PATLY.AIApplication
15992639 · WAFER-LEVEL PACKAGING FOR ENHANCED PERFORMANCE
Filed 2018-05-30 · Granted · Patent 10490471 (2019-11-26) The official file ↗The patent and its PDF ↗ · Art unit 2816 · Examiner Molly Kay Reida Typical · CPC H10W 74/121 · Qorvo US, Inc. · Qorvo and Withrow + Terranova
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to disposition 17.9 mo
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