Application

16127769 · Die Features for Self-Alignment During Die Bonding

Filed 2018-09-11 · Granted · Patent 10748857 (2020-08-18) The official file ↗The patent and its PDF ↗ · Art unit 2819 · Examiner Patricia D Valenzuela Typical · CPC H10P 72/0616 · Micron Technology, Inc. · Parsons Behle & Latimer - MICRON

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

9.9 mo

to disposition 23.2 mo

Statutes raised

102 103

2 actions read

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