Application

16179048 · INORGANIC WAFER HAVING THROUGH-HOLES ATTACHED TO SEMICONDUCTOR WAFER

Filed 2018-11-02 · Granted · Patent 10756003 (2020-08-25) The official file ↗The patent and its PDF ↗ · Art unit 2818 · Examiner Tu Tu V Ho Easy · CPC H10W 20/20 · CORNING INCORPORATED · CORNING INCORPORATED

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

8.5 mo

to disposition 21.7 mo

Statutes raised

103

2 actions read

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