PATLY.AIApplication
16193905 · STRUCTURE AND METHOD OF LATCHUP ROBUSTNESS WITH PLACEMENT OF THROUGH WAFER VIA WITHIN CMOS CIRCUITRY
Filed 2018-11-16 · Granted · Patent 10978452 (2021-04-13) The official file ↗The patent and its PDF ↗ · Art unit 2897 · Examiner Bryan R. Junge Hard · CPC H10D 84/854 · INTERNATIONAL BUSINESS MACHINES CORPORATION · INACTIVE INTERNATIONAL BUSINESS MACHINES CORP
Office actions
2
first was Non-final rejection
RCEs
0
no appeal
To first action
17.2 mo
to disposition 28.9 mo
Statutes raised
103 112
2 actions read