Application

16194734 · METHODS OF FORMING LEADLESS SEMICONDUCTOR PACKAGES WITH PLATED LEADFRAMES AND WETTABLE FLANKS

Filed 2018-11-19 · Granted · Patent 11145581 (2021-10-12) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10W 74/014 · SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC · onsemi (IPTechLaw)

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

11.9 mo

to disposition 34.8 mo

Statutes raised

102 103 112

5 actions read

Unlock the prosecution timelineIncluded in Pro, from $29 a month. Cancel any time.