Application

16229360 · WAFER-LEVEL SYSTEM PACKAGING METHOD AND PACKAGE STRUCTURE

Filed 2018-12-21 · Granted · Patent 10756051 (2020-08-25) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10W 90/00 · Ningbo Semiconductor International Corporation · Anova Law Group c/o SMIC

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

13.5 mo

to disposition 20.1 mo

Statutes raised

0 actions read

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