Application

16229850 · WAFER LEVEL PACKAGE STRUCTURE AND WAFER LEVEL PACKAGING METHOD

Filed 2018-12-21 · Granted · Patent 10784229 (2020-09-22) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10W 74/019 · Ningbo Semiconductor International Corporation · Anova Law Group c/o SMIC

Office actions

first was Non-final rejection

RCEs

no appeal

To first action

13.7 mo

to disposition 21.1 mo

Statutes raised

103 112

1 actions read

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