Application

16231733 · WAFER-LEVEL PACKAGING METHOD AND PACKAGE STRUCTURE THEREOF

Filed 2018-12-24 · Granted · Patent 10790211 (2020-09-29) The official file ↗The patent and its PDF ↗ · Art unit 2891 · Examiner Davis Thai Easy · CPC H10W 95/00 · Ningbo Semiconductor International Corporation · Anova Law Group c/o SMIC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

14.6 mo

to disposition 21.2 mo

Statutes raised

0 actions read

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