Application

16283578 · SOI WAFERS AND DEVICES WITH BURIED STRESSOR

Filed 2019-02-22 · Granted · Patent 10833194 (2020-11-10) The official file ↗The patent and its PDF ↗ · Art unit 2815 · Examiner Matthew E Warren Easy · CPC H10D 86/201 · Acorn Technologies, Inc. · Ascenda Law Group, PC

Office actions

first was Notice of allowance

RCEs

no appeal

To first action

16.1 mo

to disposition 20.6 mo

Statutes raised

0 actions read

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