Application

16306708 · METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD, INSULATED CIRCUIT BOARD, AND THERMOELECTRIC CONVERSION MODULE

Filed 2018-12-03 · Granted · Patent 10798824 (2020-10-06) The official file ↗The patent and its PDF ↗ · Art unit 3729 · Examiner Kaying Kue Hard · CPC H10W 40/255 · MITSUBISHI MATERIALS CORPORATION · Troutman Pepper Locke LLP

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

3.8 mo

to disposition 22.1 mo

Statutes raised

103

1 actions read

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