Application

16387501 · SUBSTRATE PRESSING MODULE, SUBSTRATE PRESSING METHOD, SUBSTRATE TREATING APPARATUS INCLUDING THE SUBSTRATE TREATING MODULE, AND THE SUBSTRATE TREATING METHOD

Filed 2019-04-17 · Granted · Patent 11315807 (2022-04-26) The official file ↗The patent and its PDF ↗ · Art unit 2895 · Examiner Jay C Chang Hard · CPC H10P 72/0428 · SEMIgear, Inc. · Park, Kim & Suh, LLC

Office actions

first was Restriction requirement

RCEs

no appeal

To first action

21.8 mo

to disposition 36.3 mo

Statutes raised

102 112

1 actions read

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