PATLY.AIApplication
16390950 · FULLY MOLDED SEMICONDUCTOR PACKAGE FOR POWER DEVICES AND METHOD OF MAKING THE SAME
Filed 2019-04-22 · Granted · Patent 10818635 (2020-10-27) The official file ↗The patent and its PDF ↗ · Art unit 2896 · Examiner Bitew A Dinke Hard · CPC H10P 54/00 · Deca Technologies Inc. · BOOTH UDALL, PLC
Office actions
3
first was Non-final rejection
RCEs
1
no appeal
To first action
1.6 mo
to disposition 18.2 mo
Statutes raised
103 112
3 actions read